Interconnect Noise Optimization in Nanometer Technologies - Tapa dura

Bayoumi, Magdy; Elgamel, Mohamed

 
9780387258706: Interconnect Noise Optimization in Nanometer Technologies
Tapa dura
ISBN 10: 0387258701 ISBN 13: 9780387258706
Editorial: Springer, 2005

Sinopsis

Presents a range of CAD algorithms and techniques for synthesizing and optimizing interconnect

Provides insight & intuition into layout analysis and optimization for interconnect in high speed, high complexity integrated circuits

"Sinopsis" puede pertenecer a otra edición de este libro.

De la contraportada

Interconnect has become the dominating factor in determining system performance in nanometer technologies. Dedicated to this subject, Interconnect Noise Optimization in Nanometer Technologies provides insight and intuition into layout analysis and optimization for interconnect in high speed, high complexity integrated circuits.

The authors bring together a wealth of information presenting a range of CAD algorithms and techniques for synthesizing and optimizing interconnect. Practical aspects of the algorithms and the models are explained with sufficient details. The book investigates the most effective parameters in layout optimization. Different post-layout optimization techniques with complexity analysis and benchmarks tests are provided. The impact crosstalk noise and coupling on the wire delay is analyzed. Parameters that affect signal integrity are also considered.

"Sobre este título" puede pertenecer a otra edición de este libro.

Editorial
Springer
Año de publicación
2005
Idioma
Inglés
ISBN 10 
0387258701
ISBN 13 
9780387258706
Encuadernación
Tapa dura
Número de páginas
160
Contacto del fabricante
no disponible
Persona responsable
CMN Printpool Inh. Mathis Neumann
https://www.also.com/ec/cms5/en_6000/6000/index.jsp

Friedrich-Karl-Str. 9
Hamburg
Alemania

Otras ediciones populares con el mismo título

9781441938442: Interconnect Noise Optimization in Nanometer Technologies

Edición Destacada

ISBN 10:  1441938443 ISBN 13:  9781441938442
Editorial: Springer, 2010
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