This year, the IFIP Working Conference on Distributed and Parallel Embedded Sys tems (DIPES 2008) is held as part of the IFIP World Computer Congress, held in Milan on September 7 10, 2008. The embedded systems world has a great deal of experience with parallel and distributed computing. Many embedded computing systems require the high performance that can be delivered by parallel computing. Parallel and distributed computing are often the only ways to deliver adequate real time performance at low power levels. This year's conference attracted 30 submissions, of which 21 were accepted. Prof. Jor ¨ g Henkel of the University of Karlsruhe graciously contributed a keynote address on embedded computing and reliability. We would like to thank all of the program committee members for their diligence. Wayne Wolf, Bernd Kleinjohann, and Lisa Kleinjohann Acknowledgements We would like to thank all people involved in the organization of the IFIP World Computer Congress 2008, especially the IPC Co Chairs Judith Bishop and Ivo De Lotto, the Organization Chair Giulio Occhini, as well as the Publications Chair John Impagliazzo. Further thanks go to the authors for their valuable contributions to DIPES 2008. Last but not least we would like to acknowledge the considerable amount of work and enthusiasm spent by our colleague Claudius Stern in preparing theproceedingsofDIPES2008. Hemadeitpossibletoproducethemintheircurrent professional and homogeneous style.
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International Federation for Information Processing
The IFIP series publishes state-of-the-art results in the sciences and technologies of information and communication. The scope of the series includes: foundations of computer science; software theory and practice; education; computer applications in technology; communication systems; systems modeling and optimization; information systems; computers and society; computer systems technology; security and protection in information processing systems; artificial intelligence; and human-computer interaction. Proceedings and post-proceedings of refereed international conferences in computer science and interdisciplinary fields are featured. These results often precede journal publication and represent the most current research. The principal aim of the IFIP series is to encourage education and the dissemination and exchange of information about all aspects of computing.
For more information about the 300 other books in the IFIP series, please visit www.springer.com.
For more information about IFIP, please visit www.ifip.org.
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Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This year, the IFIP Working Conference on Distributed and Parallel Embedded Sys tems (DIPES 2008) is held as part of the IFIP World Computer Congress, held in Milan on September 7 10, 2008. The embedded systems world has a great deal of experience with parallel and distributed computing. Many embedded computing systems require the high performance that can be delivered by parallel computing. Parallel and distributed computing are often the only ways to deliver adequate real time performance at low power levels. This year's conference attracted 30 submissions, of which 21 were accepted. Prof. Jor g Henkel of the University of Karlsruhe graciously contributed a keynote address on embedded computing and reliability. We would like to thank all of the program committee members for their diligence. Wayne Wolf, Bernd Kleinjohann, and Lisa Kleinjohann Acknowledgements We would like to thank all people involved in the organization of the IFIP World Computer Congress 2008, especially the IPC Co Chairs Judith Bishop and Ivo De Lotto, the Organization Chair Giulio Occhini, as well as the Publications Chair John Impagliazzo. Further thanks go to the authors for their valuable contributions to DIPES 2008. Last but not least we would like to acknowledge the considerable amount of work and enthusiasm spent by our colleague Claudius Stern in preparing theproceedingsofDIPES2008. Hemadeitpossibletoproducethemintheircurrent professional and homogeneous style. Nº de ref. del artículo: 9780387096605
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