Scanning Electron Microscope Examination of Wire Bonds From High-Reliability Devices: Nbs Technical Note 785 (Classic Reprint) - Tapa blanda

Sinopsis

Excerpt from Scanning Electron Microscope Examination of Wire Bonds From High-Reliability Devices: Nbs Technical Note 785

Of the several hundred sem photographs made, the examples shown were selected to be indicative of particular faults. It is not intended to suggest that the faults illustrated are unique to a particular device type, production line, or circuit configuration. In fact, most of the faults were observed to some extent in all types of the devices investi gated.

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