Methods of Measurement for Semiconductor Materials, Process Control, and Devices: Quarterly Report; April 1 to June 30, 1969 (Classic Reprint) - Tapa dura

Sinopsis

Excerpt from Methods of Measurement for Semiconductor Materials, Process Control, and Devices: Quarterly Report; April 1 to June 30, 1969

I. An improved method for grasping the wire during a pull test was developed last quarter. Since the wire is grasped with out deformation and the bond may be pulled in any direction, this convenient method, which involves the use of a quick setting hot-melt glue, permits increased control of the test conditions. It is also possible to test single bonds.

About the Publisher

Forgotten Books publishes hundreds of thousands of rare and classic books. Find more at www.forgottenbooks.com

This book is a reproduction of an important historical work. Forgotten Books uses state-of-the-art technology to digitally reconstruct the work, preserving the original format whilst repairing imperfections present in the aged copy. In rare cases, an imperfection in the original, such as a blemish or missing page, may be replicated in our edition. We do, however, repair the vast majority of imperfections successfully; any imperfections that remain are intentionally left to preserve the state of such historical works.

"Sinopsis" puede pertenecer a otra edición de este libro.