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Fabrication Engineering at the Micro- and Nanoscale, 3rd edition (The Oxford Series in Electrical and Computer Engineering) - Tapa blanda
Sinopsis
Book by Campbell Stephen A
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Reseña del editor
Designed for advanced undergraduate or first-year graduate courses in semiconductor or microelectronic fabrication, the third edition of Fabrication Engineering at the Micro and Nanoscale provides a thorough and accessible introduction to all fields of micro and nano fabrication. Completely revised and updated, the text covers the entire basic unit processes used to fabricate integrated circuits and other devices. It includes more worked examples, illustrations, and expands coverage of the frontiers of fabrication processes.
The physics and chemistry of each process are introduced along with descriptions of the equipment used to carry out the processes. The text uses a popular commercial process simulation suite—the Silvaco Athena® set of codes—to provide meaningful examples of many of the basic processes including diffusion, oxidation, lithography, and deposition.
The book goes on to discuss the integration of these basic unit processes into various technologies, concentrating on CMOS transistors. The text breaks down the material into treatments on the concepts of process modules, thermal budget, advanced architectures, and the use of channel strain for improved performance.
Biografía del autor
Stephen A. Campbell is Professor of Electrical and Computer Engineering at the University of Minnesota, Distinguished Professor of the Institute of Technology, Director of the Nanofabrication Center, and Director of the Center for Nanostructure Applications. He has extensive experience in both academia and industry in microelectronic processing. His current research interests include the application of semiconductor nanoparticles for high performance electronic and optoelectronic devices, advanced materials, novel sensors and transistor structures, and various applications of MEMS.
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- EditorialOxford University Press
- Año de publicación2007
- ISBN 10 0195320174
- ISBN 13 9780195320176
- EncuadernaciónTapa blanda
- IdiomaInglés
- Número de edición3
- Número de páginas666
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Fabrication Engineering at the Micro- and Nanoscale, 3rd edition
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Oxford University Press, 2007
ISBN 10: 0195320174
ISBN 13: 9780195320176
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Fabrication Engineering at the Micro and Nanoscale (The ^AOxford Series in Electrical and Computer Engineering)
Publicado por
Oxford University Press, 2007
ISBN 10: 0195320174
ISBN 13: 9780195320176
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Fabrication Engineering at the Micro and Nanoscale, 3rd edition
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Cary, North Carolina, U.S.A.: Oxford Univ Pr, 2007
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ISBN 13: 9780195320176
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Fabrication Engineering at the Micro and Nanoscale (The Oxford Series in Electrical and Computer Engineering)
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ISBN 10: 0195320174
ISBN 13: 9780195320176
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Fabrication Engineering at the Micro and Nanoscale (The ^AOxford Series in Electrical and Computer Engineering)
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ISBN 13: 9780195320176
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Fabrication Engineering at the Micro and Nanoscale (The ^AOxford Series in Electrical and Computer Engineering)
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ISBN 10: 0195320174
ISBN 13: 9780195320176
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Fabrication Engineering at the Micro and Nanoscale
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Fabrication Engineering at the Micro- And Nanoscale (Paperback)
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ISBN 13: 9780195320176
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Paperback. Condición: new. Paperback. Designed for advanced undergraduate or first-year graduate courses in semiconductor or microelectronic fabrication, the third edition of Fabrication Engineering at the Micro and Nanoscale provides a thorough and accessible introduction to all fields of micro and nano fabrication. Completely revised and updated, the text covers the entire basic unit processes used to fabricate integrated circuits and other devices. It includes more worked examples, illustrations, and expands coverage of the frontiers of fabrication processes. The physics and chemistry of each process are introduced along with descriptions of the equipment used to carry out the processes. The text uses a popular commercial process simulation suite—the Silvaco AthenaRG set of codes—to provide meaningful examples of many of the basic processes including diffusion, oxidation, lithography, and deposition. The book goes on to discuss the integration of these basic unit processes into various technologies, concentrating on CMOS transistors. The text breaks down the material into treatments on the concepts of process modules, thermal budget, advanced architectures, and the use of channel strain for improved performance. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability. Nº de ref. del artículo: 9780195320176
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