Reliability and Failure Analysis of High-Power LED Packaging (Woodhead Publishing Series in Electronic and Optical Materials) - Tapa blanda

Acerca de los autores

Professor Cher Ming Tan obtained his PhD in Electrical Engineering from the University of Toronto in 1992. He has eight years of working experience in reliability in the electronics industry (both Singapore and Taiwan) before joining Nanyang Technological University (NTU) as a faculty member in 1996 where he stayed until 2014. He is now a Professor at Chang Gung University, Taiwan, and the Director of the Centre of Reliability Science and Technology (CReST). He has published more than 400 international journal and conference papers and holds 14 patents and 1 copyright for reliability software. He has given more than 100 keynote and invited talks at international conferences. He has written 6 books and 4 book chapters in the field of reliability. He is the Series Editor of Springer Briefs in Reliability, Editor of Scientific Reports, Editor of IEEE Transactions on Materials and Device Reliability, Associate Editor of Microelectronics Reliability, and Research Editor of Frontiers in Materials. He is Fellow of the Institute of Engineers, Singapore, Fellow of the Singapore Quality Institute, and an IEEE Electron Devices Distinguished Lecturer. He is also on the technical committee for reviewing IEEE Reliability Standards 1413.1 and 1624.

Dr. Preetpal Singh received his BS from the Guru Nanak Engineering College, Hyderabad, India, in 2007, and MS from Amity University, Noida, India, in 2013. He completed his PhD in 2018 with the Department of Electronic Engineering and Center for Reliability Sciences and Technologies (CReST), Chang Gung University in Taoyuan, Taiwan. His research interests include graphene-based high-power LEDs, high-power LED degradation study, and LED reliability. He has published his research in reputed journals like the IEEE-TDMR, Microelectronics Reliability, and Scientific Reports. He holds a US patent for his work on High Power LEDs substrate―GaN thermal and lattice mismatch improvement. He is also the Reviewer for the IEEE-TDMR and microelectronics journals. Presently he is working with Epistar, Taiwan, as Senior Research Engineer and is responsible for development of different types of LEDs.

De la contraportada

Reliability and Failure Analysis of High Power LED Packaging provides the fundamental understanding of the reliability and failure analysis materials interfaces for high power LEDs packaging with the ultimate goal of enabling new packaging materials.

This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide new insights for readers regarding the different possible failure mechanisms in high power LEDs.

The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to a harsher stress conditions that high-power LEDs have to face. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs.