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This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
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Descripción Hardcover. Condición: new. Nº de ref. del artículo: 9783540431817
Descripción Condición: New. Nº de ref. del artículo: ABLIING23Mar3113020167433
Descripción Condición: New. Nº de ref. del artículo: 2181102-n
Descripción Gebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Comprehensive book covering the technology of CMP for all semiconductor related materials, as well as the science and modelling of the various mechanismsThis book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, . Nº de ref. del artículo: 4890299
Descripción Condición: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book. Nº de ref. del artículo: ria9783540431817_lsuk
Descripción Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed. 444 pp. Englisch. Nº de ref. del artículo: 9783540431817
Descripción Condición: New. Nº de ref. del artículo: 2181102-n
Descripción Condición: New. Buy with confidence! Book is in new, never-used condition 1.73. Nº de ref. del artículo: bk3540431810xvz189zvxnew
Descripción Condición: New. New! This book is in the same immaculate condition as when it was published 1.73. Nº de ref. del artículo: 353-3540431810-new
Descripción Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Chemical Mechanical Planarization (CMP) has emerged in the last two decades and grown rapidly as a basic technology widely used in semiconduc tor device fabrication. As a semiconductor processing step, it was developed at IBM in the mid 1980s. From this beginning the technology has been widely adopted throughout the semiconductor industry. As basic CMP technology has been understood and accepted throughout the semiconductor industry, its uses in different parts of the semiconductor process have multiplied. This includes special steps for some special process ing flows, such as for DRAM technology. In addition, the availability of CMP technology has enabled the implementation of new technologies, with the best example being copper interconnect technology. Copper could not be practi cally implemented into semiconductor process flows until the advent of CMP. Unfortunately, the rapid acceptance and implementation of CMP technol ogy in wafer fabrication has occurred without a corresponding rate of advance in the underlying science. Progress is being made in understanding the un derlying CMP mechanisms, but, in general, it is slow and uneven. The most noteworthy exception to this trend is the science of metal CMP reactions, where the scientific understanding is actually driving much of the advance of the technology. There has been no corresponding progress in other CMP areas however. Nº de ref. del artículo: 9783540431817