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Publicado por Springer, 2004
ISBN 10: 3540431810ISBN 13: 9783540431817
Librería: ThriftBooks-Dallas, Dallas, TX, Estados Unidos de America
Libro
Hardcover. Condición: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less 1.75.
Publicado por Springer-Verlag Publishing, 2004
ISBN 10: 3540431810ISBN 13: 9783540431817
Librería: Salish Sea Books, Bellingham, WA, Estados Unidos de America
Libro
Condición: Very Good. Very Good; Hardcover; Covers are still glossy with a few light handling-marks; Unblemished textblock edges; The endpapers and all text pages are clean and unmarked; The binding is excellent with a straight spine; This book will be shipped in a sturdy cardboard box with foam padding; Medium Format (8.5" - 9.75" tall); 1.7 lbs; Tan, red, and gray covers with title in white lettering; 2004, Springer-Verlag Publishing; 439 pages; "Chemical Mechanical Planarization of Semiconductor Materials," by M.R. Oliver.
Publicado por Springer, 2004
ISBN 10: 3540431810ISBN 13: 9783540431817
Librería: GF Books, Inc., Hawthorne, CA, Estados Unidos de America
Libro
Condición: Good. Book is in Used-Good condition. Pages and cover are clean and intact. Used items may not include supplementary materials such as CDs or access codes. May show signs of minor shelf wear and contain limited notes and highlighting. 1.73.
Publicado por Springer Berlin Heidelberg, 2010
ISBN 10: 3642077382ISBN 13: 9783642077388
Librería: booksXpress, Bayonne, NJ, Estados Unidos de America
Libro
Soft Cover. Condición: new.
Publicado por Springer, 2004
ISBN 10: 3540431810ISBN 13: 9783540431817
Librería: booksXpress, Bayonne, NJ, Estados Unidos de America
Libro
Hardcover. Condición: new.
Publicado por Springer, 2010
ISBN 10: 3642077382ISBN 13: 9783642077388
Librería: Book Deals, Tucson, AZ, Estados Unidos de America
Libro
Condición: Fair. Acceptable/Fair condition. Book is worn, but the pages are complete, and the text is legible. Has wear to binding and pages, may be ex-library. 1.49.
Publicado por Springer, 2010
ISBN 10: 3642077382ISBN 13: 9783642077388
Librería: Books Unplugged, Amherst, NY, Estados Unidos de America
Libro
Condición: Fair. Buy with confidence! Book is in acceptable condition with wear to the pages, binding, and some marks within 1.49.
Publicado por Springer, 2010
ISBN 10: 3642077382ISBN 13: 9783642077388
Librería: Books Unplugged, Amherst, NY, Estados Unidos de America
Libro
Condición: Good. Buy with confidence! Book is in good condition with minor wear to the pages, binding, and minor marks within 1.49.
Publicado por Springer, 2010
ISBN 10: 3642077382ISBN 13: 9783642077388
Librería: GF Books, Inc., Hawthorne, CA, Estados Unidos de America
Libro
Condición: Very Good. Book is in Used-VeryGood condition. Pages and cover are clean and intact. Used items may not include supplementary materials such as CDs or access codes. May show signs of minor shelf wear and contain very limited notes and highlighting. 1.49.
Publicado por Springer, 2010
ISBN 10: 3642077382ISBN 13: 9783642077388
Librería: GF Books, Inc., Hawthorne, CA, Estados Unidos de America
Libro
Condición: Fine. Book is in Used-LikeNew condition. Pages and cover are clean and intact. Used items may not include supplementary materials such as CDs or access codes. May show signs of minor shelf wear.
Publicado por Springer, 2004
ISBN 10: 3540431810ISBN 13: 9783540431817
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
Libro
Condición: New.
Publicado por Springer, 2004
ISBN 10: 3540431810ISBN 13: 9783540431817
Librería: Lucky's Textbooks, Dallas, TX, Estados Unidos de America
Libro
Condición: New.
Publicado por Springer, 2010
ISBN 10: 3642077382ISBN 13: 9783642077388
Librería: Lucky's Textbooks, Dallas, TX, Estados Unidos de America
Libro
Condición: New.
Publicado por Springer, 2010
ISBN 10: 3642077382ISBN 13: 9783642077388
Librería: GF Books, Inc., Hawthorne, CA, Estados Unidos de America
Libro
Condición: New. Book is in NEW condition. 1.49.
Publicado por Springer, 2010
ISBN 10: 3642077382ISBN 13: 9783642077388
Librería: Book Deals, Tucson, AZ, Estados Unidos de America
Libro
Condición: New. New! This book is in the same immaculate condition as when it was published 1.49.
Publicado por Springer Berlin Heidelberg, 2004
ISBN 10: 3540431810ISBN 13: 9783540431817
Librería: moluna, Greven, Alemania
Libro Impresión bajo demanda
Gebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Comprehensive book covering the technology of CMP for all semiconductor related materials, as well as the science and modelling of the various mechanismsThis book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, .
Publicado por Springer Berlin Heidelberg, 2010
ISBN 10: 3642077382ISBN 13: 9783642077388
Librería: moluna, Greven, Alemania
Libro Impresión bajo demanda
Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Comprehensive book covering the technology of CMP for all semiconductor related materials, as well as the science and modelling of the various mechanismsThis book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, .
Publicado por Springer, 2010
ISBN 10: 3642077382ISBN 13: 9783642077388
Librería: Ria Christie Collections, Uxbridge, Reino Unido
Libro Impresión bajo demanda
Condición: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book.
Publicado por Springer, 2004
ISBN 10: 3540431810ISBN 13: 9783540431817
Librería: Ria Christie Collections, Uxbridge, Reino Unido
Libro Impresión bajo demanda
Condición: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book.
Publicado por Springer, 2004
ISBN 10: 3540431810ISBN 13: 9783540431817
Librería: GreatBookPricesUK, Castle Donington, DERBY, Reino Unido
Libro
Condición: New.
Publicado por Springer Berlin Heidelberg Jan 2004, 2004
ISBN 10: 3540431810ISBN 13: 9783540431817
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
Libro Impresión bajo demanda
Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed. 444 pp. Englisch.
Publicado por Springer Berlin Heidelberg Dez 2010, 2010
ISBN 10: 3642077382ISBN 13: 9783642077388
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
Libro Impresión bajo demanda
Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed. 444 pp. Englisch.
Publicado por Springer Berlin Heidelberg, 2010
ISBN 10: 3642077382ISBN 13: 9783642077388
Librería: AHA-BUCH GmbH, Einbeck, Alemania
Libro
Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Chemical Mechanical Planarization (CMP) has emerged in the last two decades and grown rapidly as a basic technology widely used in semiconduc tor device fabrication. As a semiconductor processing step, it was developed at IBM in the mid 1980s. From this beginning the technology has been widely adopted throughout the semiconductor industry. As basic CMP technology has been understood and accepted throughout the semiconductor industry, its uses in different parts of the semiconductor process have multiplied. This includes special steps for some special process ing flows, such as for DRAM technology. In addition, the availability of CMP technology has enabled the implementation of new technologies, with the best example being copper interconnect technology. Copper could not be practi cally implemented into semiconductor process flows until the advent of CMP. Unfortunately, the rapid acceptance and implementation of CMP technol ogy in wafer fabrication has occurred without a corresponding rate of advance in the underlying science. Progress is being made in understanding the un derlying CMP mechanisms, but, in general, it is slow and uneven. The most noteworthy exception to this trend is the science of metal CMP reactions, where the scientific understanding is actually driving much of the advance of the technology. There has been no corresponding progress in other CMP areas however.
Publicado por Springer Berlin Heidelberg, 2004
ISBN 10: 3540431810ISBN 13: 9783540431817
Librería: AHA-BUCH GmbH, Einbeck, Alemania
Libro
Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Chemical Mechanical Planarization (CMP) has emerged in the last two decades and grown rapidly as a basic technology widely used in semiconduc tor device fabrication. As a semiconductor processing step, it was developed at IBM in the mid 1980s. From this beginning the technology has been widely adopted throughout the semiconductor industry. As basic CMP technology has been understood and accepted throughout the semiconductor industry, its uses in different parts of the semiconductor process have multiplied. This includes special steps for some special process ing flows, such as for DRAM technology. In addition, the availability of CMP technology has enabled the implementation of new technologies, with the best example being copper interconnect technology. Copper could not be practi cally implemented into semiconductor process flows until the advent of CMP. Unfortunately, the rapid acceptance and implementation of CMP technol ogy in wafer fabrication has occurred without a corresponding rate of advance in the underlying science. Progress is being made in understanding the un derlying CMP mechanisms, but, in general, it is slow and uneven. The most noteworthy exception to this trend is the science of metal CMP reactions, where the scientific understanding is actually driving much of the advance of the technology. There has been no corresponding progress in other CMP areas however.
Publicado por Springer, 2004
ISBN 10: 3540431810ISBN 13: 9783540431817
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
Libro
Condición: As New. Unread book in perfect condition.
Publicado por Springer, 2004
ISBN 10: 3540431810ISBN 13: 9783540431817
Librería: Books Puddle, New York, NY, Estados Unidos de America
Libro
Condición: New. pp. 444.
Publicado por Springer, 2004
ISBN 10: 3540431810ISBN 13: 9783540431817
Librería: GreatBookPricesUK, Castle Donington, DERBY, Reino Unido
Libro
Condición: As New. Unread book in perfect condition.
Publicado por Springer, 2004
ISBN 10: 3540431810ISBN 13: 9783540431817
Librería: Majestic Books, Hounslow, Reino Unido
Libro Impresión bajo demanda
Condición: New. Print on Demand pp. 444 Illus.
Publicado por Springer, 2010
ISBN 10: 3642077382ISBN 13: 9783642077388
Librería: Mispah books, Redhill, SURRE, Reino Unido
Libro
Paperback. Condición: Like New. Like New. book.