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Descripción Hardcover. Condición: new. Nº de ref. del artículo: 9781441909619
Descripción Condición: New. Nº de ref. del artículo: ABLIING23Mar2411530293440
Descripción Condición: New. Nº de ref. del artículo: I-9781441909619
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Descripción Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place.This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain. 246 pp. Englisch. Nº de ref. del artículo: 9781441909619
Descripción Hardback. Condición: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days. Nº de ref. del artículo: C9781441909619
Descripción Condición: New. Editor(s): Papanikolaou, Antonis; Soudris, Dimitrios (Department of Electrical and Computer Engineering, Democritus University of Thrace, Xanthi, Greece); Radojcic, Riko. Num Pages: 254 pages, biography. BIC Classification: TBD; TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 15. Weight in Grams: 537. . 2010. Hardback. . . . . Nº de ref. del artículo: V9781441909619
Descripción Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place.This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain. Nº de ref. del artículo: 9781441909619
Descripción Gebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Covers the entire range of 3D chip stacking topics in such a way that a non-expert (in 3D integration) reader can understand exactly what this technology is, why it is beneficial, how it changes conventional practices and how it can affect his/her workProv. Nº de ref. del artículo: 4172145
Descripción Condición: New. Editor(s): Papanikolaou, Antonis; Soudris, Dimitrios (Department of Electrical and Computer Engineering, Democritus University of Thrace, Xanthi, Greece); Radojcic, Riko. Num Pages: 254 pages, biography. BIC Classification: TBD; TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 15. Weight in Grams: 537. . 2010. Hardback. . . . . Books ship from the US and Ireland. Nº de ref. del artículo: V9781441909619