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Publicado por Springer, 2010
ISBN 10: 1441909613ISBN 13: 9781441909619
Librería: booksXpress, Bayonne, NJ, Estados Unidos de America
Libro
Hardcover. Condición: new.
Publicado por Springer, 2010
ISBN 10: 1441909613ISBN 13: 9781441909619
Librería: Lucky's Textbooks, Dallas, TX, Estados Unidos de America
Libro
Condición: New.
Publicado por Springer, 2010
ISBN 10: 1441909613ISBN 13: 9781441909619
Librería: California Books, Miami, FL, Estados Unidos de America
Libro
Condición: New.
Publicado por Springer, 2010
ISBN 10: 1441909613ISBN 13: 9781441909619
Librería: Ria Christie Collections, Uxbridge, Reino Unido
Libro Impresión bajo demanda
Condición: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book.
Publicado por Springer US Sep 2014, 2014
ISBN 10: 1489981829ISBN 13: 9781489981820
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
Libro Impresión bajo demanda
Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place.This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain. 256 pp. Englisch.
Publicado por SPRINGER US Dez 2010, 2010
ISBN 10: 1441909613ISBN 13: 9781441909619
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
Libro Impresión bajo demanda
Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place.This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain. 246 pp. Englisch.
Publicado por Springer-Verlag New York Inc., 2010
ISBN 10: 1441909613ISBN 13: 9781441909619
Librería: THE SAINT BOOKSTORE, Southport, Reino Unido
Libro Impresión bajo demanda
Hardback. Condición: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
Publicado por SPRINGER US, 2010
ISBN 10: 1441909613ISBN 13: 9781441909619
Librería: Buchpark, Trebbin, Alemania
Libro
Condición: Sehr gut. Zustand: Sehr gut - Neubindung, Buchschnitt leicht verkürzt, Buchrücken leicht angestoßen | Seiten: 246 | Sprache: Englisch.
Publicado por Springer-Verlag New York Inc., 2010
ISBN 10: 1441909613ISBN 13: 9781441909619
Librería: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlanda
Libro
Condición: New. Editor(s): Papanikolaou, Antonis; Soudris, Dimitrios (Department of Electrical and Computer Engineering, Democritus University of Thrace, Xanthi, Greece); Radojcic, Riko. Num Pages: 254 pages, biography. BIC Classification: TBD; TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 15. Weight in Grams: 537. . 2010. Hardback. . . . .
Publicado por Springer US, 2014
ISBN 10: 1489981829ISBN 13: 9781489981820
Librería: AHA-BUCH GmbH, Einbeck, Alemania
Libro
Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place.This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
Publicado por Springer Nature Singapore, 2010
ISBN 10: 1441909613ISBN 13: 9781441909619
Librería: AHA-BUCH GmbH, Einbeck, Alemania
Libro
Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place.This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
Publicado por Springer US, 2014
ISBN 10: 1489981829ISBN 13: 9781489981820
Librería: moluna, Greven, Alemania
Libro Impresión bajo demanda
Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Covers the entire range of 3D chip stacking topics in such a way that a non-expert (in 3D integration) reader can understand exactly what this technology is, why it is beneficial, how it changes conventional practices and how it can affect his/her workProv.
Publicado por Springer US, 2010
ISBN 10: 1441909613ISBN 13: 9781441909619
Librería: moluna, Greven, Alemania
Libro Impresión bajo demanda
Gebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Covers the entire range of 3D chip stacking topics in such a way that a non-expert (in 3D integration) reader can understand exactly what this technology is, why it is beneficial, how it changes conventional practices and how it can affect his/her workProv.
Publicado por Springer, 2014
ISBN 10: 1489981829ISBN 13: 9781489981820
Librería: Revaluation Books, Exeter, Reino Unido
Libro
Paperback. Condición: Brand New. 254 pages. 9.25x6.10x0.58 inches. In Stock.
Publicado por Springer-Verlag New York Inc., 2010
ISBN 10: 1441909613ISBN 13: 9781441909619
Librería: Kennys Bookstore, Olney, MD, Estados Unidos de America
Libro
Condición: New. Editor(s): Papanikolaou, Antonis; Soudris, Dimitrios (Department of Electrical and Computer Engineering, Democritus University of Thrace, Xanthi, Greece); Radojcic, Riko. Num Pages: 254 pages, biography. BIC Classification: TBD; TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 15. Weight in Grams: 537. . 2010. Hardback. . . . . Books ship from the US and Ireland.
Publicado por Springer, 2010
ISBN 10: 1441909613ISBN 13: 9781441909619
Librería: Mispah books, Redhill, SURRE, Reino Unido
Libro
Hardcover. Condición: Like New. Like New. book.