Publicado por The Institution of Engineering and Technology, 2019
ISBN 10: 1785613871 ISBN 13: 9781785613876
Librería: Books Puddle, New York, NY, Estados Unidos de America
Condición: New.
Publicado por The Institution of Engineering and Technology, 2019
ISBN 10: 1785613871 ISBN 13: 9781785613876
Librería: Book Deals, Tucson, AZ, Estados Unidos de America
Condición: Fine. Like New condition. Great condition, but not exactly fully crisp. The book may have been opened and read, but there are no defects to the book, jacket or pages. 1.05.
Publicado por The Institution of Engineering and Technology, 2019
ISBN 10: 1785613871 ISBN 13: 9781785613876
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
Condición: New.
Publicado por The Institution of Engineering and Technology, 2019
ISBN 10: 1785613871 ISBN 13: 9781785613876
Librería: California Books, Miami, FL, Estados Unidos de America
Condición: New.
Publicado por The Institution of Engineering and Technology, 2019
ISBN 10: 1785613871 ISBN 13: 9781785613876
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
Condición: As New. Unread book in perfect condition.
Publicado por Institution of Engineering and Technology, 2019
ISBN 10: 1785613871 ISBN 13: 9781785613876
Librería: PBShop.store US, Wood Dale, IL, Estados Unidos de America
HRD. Condición: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
Publicado por The Institution of Engineering and Technology, 2019
ISBN 10: 1785613871 ISBN 13: 9781785613876
Librería: Ria Christie Collections, Uxbridge, Reino Unido
Condición: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book.
Publicado por Institution of Engineering and Technology, 2019
ISBN 10: 1785613871 ISBN 13: 9781785613876
Librería: PBShop.store UK, Fairford, GLOS, Reino Unido
HRD. Condición: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
Publicado por Inst of Engineering & Technology, 2019
ISBN 10: 1785613871 ISBN 13: 9781785613876
Librería: Revaluation Books, Exeter, Reino Unido
Hardcover. Condición: Brand New. 250 pages. 9.21x6.14x0.55 inches. In Stock.
Publicado por The Institution of Engineering and Technology, 2019
ISBN 10: 1785613871 ISBN 13: 9781785613876
Librería: GreatBookPricesUK, Castle Donington, DERBY, Reino Unido
Condición: New.
Publicado por The Institution of Engineering and Technology, 2019
ISBN 10: 1785613871 ISBN 13: 9781785613876
Librería: GreatBookPricesUK, Castle Donington, DERBY, Reino Unido
Condición: As New. Unread book in perfect condition.
Publicado por INSTITUTION OF ENGINEERING & T, 2019
ISBN 10: 1785613871 ISBN 13: 9781785613876
Librería: moluna, Greven, Alemania
Gebunden. Condición: New. Über den AutorrnrnMinoru Fujishima is a professor of the Graduate School of Advanced Sciences of Matter, Hiroshima University, where his current research interests are in the designs of low-power millimeter- and short-millimeter-wave wir.
Publicado por The Institution of Engineering and Technology, 2019
ISBN 10: 1785613871 ISBN 13: 9781785613876
Librería: THE SAINT BOOKSTORE, Southport, Reino Unido
Condición: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
Publicado por The Institution of Engineering and Technology, 2019
ISBN 10: 1785613871 ISBN 13: 9781785613876
Librería: Mispah books, Redhill, SURRE, Reino Unido
Hardcover. Condición: New. New. book.
Publicado por The Institution of Engineering and Technology, 2019
ISBN 10: 1785613871 ISBN 13: 9781785613876
Librería: booksXpress, Bayonne, NJ, Estados Unidos de America
Hardcover. Condición: new.
Publicado por Institution Of Engineering & Technology Aug 2019, 2019
ISBN 10: 1785613871 ISBN 13: 9781785613876
Librería: AHA-BUCH GmbH, Einbeck, Alemania
Buch. Condición: Neu. Neuware - This book describes recent research on terahertz CMOS design for high-speed wireless communication. The topics covered include fundamental technologies for terahertz CMOS design, amplifier design, physical design approaches, transceiver design, and future prospects.