Publicado por Springer, 2006
ISBN 10: 1846283094 ISBN 13: 9781846283093
Librería: Books Puddle, New York, NY, Estados Unidos de America
Condición: New. pp. 222.
Publicado por Springer, 2006
ISBN 10: 1846283094 ISBN 13: 9781846283093
Librería: Majestic Books, Hounslow, Reino Unido
Condición: New. pp. 222 Illus.
Publicado por Springer, 2006
ISBN 10: 1846283094 ISBN 13: 9781846283093
Librería: Romtrade Corp., STERLING HEIGHTS, MI, Estados Unidos de America
Condición: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Publicado por Springer, 2006
ISBN 10: 1846283094 ISBN 13: 9781846283093
Librería: Basi6 International, Irving, TX, Estados Unidos de America
Condición: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Publicado por Springer, 2007
ISBN 10: 1846283094 ISBN 13: 9781846283093
Librería: booksXpress, Bayonne, NJ, Estados Unidos de America
Hardcover. Condición: new.
Publicado por Springer, 2006
ISBN 10: 1846283094 ISBN 13: 9781846283093
Librería: Lucky's Textbooks, Dallas, TX, Estados Unidos de America
Condición: New.
Publicado por Springer, 2006
ISBN 10: 1846283094 ISBN 13: 9781846283093
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
Condición: New.
Publicado por Springer, 2006
ISBN 10: 1846283094 ISBN 13: 9781846283093
Librería: Ria Christie Collections, Uxbridge, Reino Unido
Condición: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book.
Publicado por Springer, 2006
ISBN 10: 1846283094 ISBN 13: 9781846283093
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
Condición: As New. Unread book in perfect condition.
Publicado por Springer, 2006
ISBN 10: 1846283094 ISBN 13: 9781846283093
Librería: GreatBookPricesUK, Castle Donington, DERBY, Reino Unido
Condición: New.
Publicado por Springer, 2006
ISBN 10: 1846283094 ISBN 13: 9781846283093
Librería: BennettBooksLtd, North Las Vegas, NV, Estados Unidos de America
Hardcover. Condición: New. In shrink wrap. Looks like an interesting title!.
Publicado por Springer London Ltd, 2006
ISBN 10: 1846283094 ISBN 13: 9781846283093
Librería: THE SAINT BOOKSTORE, Southport, Reino Unido
Hardback. Condición: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
Publicado por Springer, 2006
ISBN 10: 1846283094 ISBN 13: 9781846283093
Librería: GreatBookPricesUK, Castle Donington, DERBY, Reino Unido
Condición: As New. Unread book in perfect condition.
Publicado por Springer London, 2006
ISBN 10: 1846283094 ISBN 13: 9781846283093
Librería: moluna, Greven, Alemania
Condición: New. Covers all aspects of lead-free solders from physical properties to product assuranceThe reader will be able to choose new solders more suitable to the climate of legislation and public opinion based on a comparison of their strengths and weakness.
Publicado por Springer Dez 2006, 2006
ISBN 10: 1846283094 ISBN 13: 9781846283093
Librería: AHA-BUCH GmbH, Einbeck, Alemania
Buch. Condición: Neu. Neuware - The transition to lead-free solders seems to be a foregone conclusion with Japan and Europe leading the way. Indeed some key companies will move to lead free soon and the WEEE Directive 2002/96/EC on Waste Electrical and Electronic Equipment will require all companies doing business in the EU to transition to lead-free. Compliance with forthcoming lead-free regulations will ultimately fall to individual companies and the engineers responsible for design and prod- tion of electronic products and they must be prepared with adequate knowledge of the materials that are leading candidates and they must be prepared to fill the gaps in the data base for their own products. Research worldwide over the past 10 years has produced data and direction for choosing an alloy to substitute for near-eutectic SnPb alloys. This book will provide a valuable resource for engineers involved in the transition to products. Basic theory is presented on the physical metallurgy of soldering technology including elements of assembly, surface finishes and solder-paste technology, wetting and solidification, microstructural instability and intermetallic c- pounds and mechanical, creep and fatigue behavior. Techniques for measuring and testing are discussed and data on SnPb and various lead-free solders are presented and compared. If lead-free solder data are not available on the re- vant topic, information is presented on near-eutectic SnPb, so as to show where the gaps in knowledge need to be filled.