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Benefiting from Thermal and Mechanical Simulation in Micro-Electronics

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ISBN 10: 1441948732 / ISBN 13: 9781441948731
Editorial: Springer US, 2001
Nuevos Condición: Brand New Encuadernación de tapa blanda
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Revaluation Books
Exeter, Reino Unido

Valoración 4 estrellas

Librería en AbeBooks desde: 6 de enero de 2003

Descripción

1st edition. edition. 204 pages. 9.25x6.00x0.46 inches. In Stock. N° de ref. de la librería x-1441948732

Cantidad: 2

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Detalles bibliográficos

Título: Benefiting from Thermal and Mechanical ...

Editorial: Springer US

Año de publicación: 2001

Encuadernación: Paperback

Condición del libro: Brand New

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Sinopsis:

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development.
Main areas covered are:-

  • The impact of simulation on industry profitability
  • Approaches to simulation
  • The state-of-the-art methodologies of simulation
  • Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.
  • "Sobre este título" puede pertenecer a otra edición de este libro.

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    Condiciones de venta:

    Legal entity name: Edward Bowditch Ltd
    Legal entity form: Limited company
    Business correspondence address: Exstowe, Exton, Exeter, EX3 0PP
    Company registration number: 04916632
    VAT registration: GB834241546
    Authorised representative: Mr. E. Bowditch

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