"Sinopsis" puede pertenecer a otra edición de este libro.
Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective.
The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.
"Sobre este título" puede pertenecer a otra edición de este libro.
Gastos de envío:
EUR 11,65
De Reino Unido a Estados Unidos de America
Descripción Condición: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book. Nº de ref. del artículo: ria9780750693141_lsuk
Descripción HRD. Condición: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000. Nº de ref. del artículo: L1-9780750693141
Descripción HRD. Condición: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000. Nº de ref. del artículo: L1-9780750693141
Descripción Condición: New. Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. This title examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packa. Nº de ref. del artículo: 594942715