Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials (Professional Engineering)

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9780071386241: Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials (Professional Engineering)
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Book by John H Lau CP Wong

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Críticas:

"An excellent book in Flip Chip Technologies, March 2, 2000 Reviewer: David Young from Boston, MA I bought this book at NEPCON West on February 29 and read it on my way home to Boston. I like it very much! This book covers all the important subjects (many of those I am not aware of) on low-cost flip chip Technologies. Also, for each subject, useful data, technical know-how, and engineering analyses are presented. I strongly recommend it to everyone who is working in electronic packaging and interconnections. I am sure you will find it useful! Online reader review of Lau's Low Cost Flip Chip Technologies

Reseña del editor:

An engineer's guidebook demonstrating non-toxic electronics manufacturing processes

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1.

Lau, Dr John H., Wong, Dr C.P., Lee, Nin
Publicado por McGraw-Hill Education (2017)
ISBN 10: 0071386246 ISBN 13: 9780071386241
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Descripción McGraw-Hill Education, 2017. Hardcover. Condición: New. Brand New! This item is printed on demand. Nº de ref. del artículo: VIB0071386246

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John H. Lau
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Descripción McGraw-Hill Education, 2002. HRD. Condición: New. New Book.Shipped from US within 10 to 14 business days.THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000. Nº de ref. del artículo: IP-9780071386241

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John H. Lau
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Descripción McGraw-Hill Education, 2002. HRD. Condición: New. New Book. Delivered from our US warehouse in 10 to 14 business days. THIS BOOK IS PRINTED ON DEMAND.Established seller since 2000. Nº de ref. del artículo: IP-9780071386241

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Lau, John H.
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Descripción McGraw-Hill Education, 2018. Hardcover. Condición: New. Never used! This item is printed on demand. Nº de ref. del artículo: 0071386246

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John H. Lau; C.P. Wong; Ning-Cheng Lee; Ricky S.W. Lee
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Descripción Hardcover Sep 13, 2002. Condición: New. Nº de ref. del artículo: BSNW9780071386241

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John H. Lau, C. P. Wong, Ning-Cheng Lee
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Descripción McGraw-Hill Education - Europe, United States, 2002. Hardback. Condición: New. Language: English . Brand New Book ***** Print on Demand *****. This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead-free, halogen-free, and conductive-adhesive problem solving methods, and those demanding cost-effective designs and high-yield environmental benign manufacturing processes, this valuable reference covers all aspects of this fast-growing field. Written for design, materials, process, equipment, manufacturing, reliability, component, packaging, and system engineers, and technical and marketing managers in electronics and photonics packaging and interconnection, this book teaches a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of lead-free, halogen-free, and conductive-adhesive technologies. Among the topics explored: chip (wafer) level interconnects with lead-free solder bumps; lead-free solder wafer bumping with micro-ball mounting and paste printing methods; lead-free solder joint reliability of WLCSPs on organic and ceramic substrates; chip (wafer) level interconnects with solderless bumps such as Ni-Au, Au, and Cu, Cu wires, Au wires, Au studs, and Cu studs; design, materials, process, and reliability of WLCSPs with solderless interconnects on PCB/substrate; halogen-free molding compounds for PQFP, PBGA, and MAP-PBGA packages; environmentally benign die-attach films for PQFP and PBGA packages and lead-free die-attach bonding techniques for IC packaging; environmental issues for conventional PCBs and substrates; some environmentally conscious flame-retardants for PCBs and organic substrates; emerging technologies for fabricating environmental friendly PCBs such as design for environment, green PCB manufacturing, and environmental safety. It also includes the topics: lead-free soldering activities such as legislation, consortia programs, and regional preferences on lead-free solder alternatives; criteria, development approaches, and varieties of alloys and properties of lead-free solders; physical, mechanical, chemical, electrical, and soldering properties of lead-free solders; manufacturing process and performance of lead-free surface finishes for both PCB and component applications; implementation and execution challenges of lead-free soldering, especially for the reflow and wave soldering process; fundamental understanding of electrically conductive adhesive (ECA) technology; effects of lubricant removal and cure shrinkage on ECAs; mechanisms underlying the contact resistance shifts of ECAs; effects of electrolytes and moisture absorption on contact resistance shifts of ECAs; and stabilization of contact resistance of ECAs using various additives. Nº de ref. del artículo: APC9780071386241

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7.

John Lau, C.P. Wong, Ning-Cheng Lee, Ricky Lee
Publicado por McGraw-Hill Professional (2002)
ISBN 10: 0071386246 ISBN 13: 9780071386241
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Descripción McGraw-Hill Professional, 2002. Hardcover. Condición: New. 1. Nº de ref. del artículo: DADAX0071386246

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8.

John H. Lau, C. P. Wong, Ning-Cheng Lee
Publicado por McGraw-Hill Education - Europe, United States (2002)
ISBN 10: 0071386246 ISBN 13: 9780071386241
Nuevo Tapa dura Cantidad disponible: 10
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Descripción McGraw-Hill Education - Europe, United States, 2002. Hardback. Condición: New. Language: English . Brand New Book ***** Print on Demand *****.This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead-free, halogen-free, and conductive-adhesive problem solving methods, and those demanding cost-effective designs and high-yield environmental benign manufacturing processes, this valuable reference covers all aspects of this fast-growing field. Written for design, materials, process, equipment, manufacturing, reliability, component, packaging, and system engineers, and technical and marketing managers in electronics and photonics packaging and interconnection, this book teaches a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of lead-free, halogen-free, and conductive-adhesive technologies. Among the topics explored: chip (wafer) level interconnects with lead-free solder bumps; lead-free solder wafer bumping with micro-ball mounting and paste printing methods; lead-free solder joint reliability of WLCSPs on organic and ceramic substrates; chip (wafer) level interconnects with solderless bumps such as Ni-Au, Au, and Cu, Cu wires, Au wires, Au studs, and Cu studs; design, materials, process, and reliability of WLCSPs with solderless interconnects on PCB/substrate; halogen-free molding compounds for PQFP, PBGA, and MAP-PBGA packages; environmentally benign die-attach films for PQFP and PBGA packages and lead-free die-attach bonding techniques for IC packaging; environmental issues for conventional PCBs and substrates; some environmentally conscious flame-retardants for PCBs and organic substrates; emerging technologies for fabricating environmental friendly PCBs such as design for environment, green PCB manufacturing, and environmental safety. It also includes the topics: lead-free soldering activities such as legislation, consortia programs, and regional preferences on lead-free solder alternatives; criteria, development approaches, and varieties of alloys and properties of lead-free solders; physical, mechanical, chemical, electrical, and soldering properties of lead-free solders; manufacturing process and performance of lead-free surface finishes for both PCB and component applications; implementation and execution challenges of lead-free soldering, especially for the reflow and wave soldering process; fundamental understanding of electrically conductive adhesive (ECA) technology; effects of lubricant removal and cure shrinkage on ECAs; mechanisms underlying the contact resistance shifts of ECAs; effects of electrolytes and moisture absorption on contact resistance shifts of ECAs; and stabilization of contact resistance of ECAs using various additives. Nº de ref. del artículo: APC9780071386241

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Lau, John; Wong, C.P.; Lee, Ning-Cheng; Lee, Ricky
Publicado por McGraw-Hill Education (2002)
ISBN 10: 0071386246 ISBN 13: 9780071386241
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Descripción McGraw-Hill Education, 2002. Hardcover. Condición: New. Nº de ref. del artículo: INGM9780071386241

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Lau, John; Wong, C.P.; Lee, Ning-Cheng; Lee, Ricky
Publicado por McGraw-Hill Education
ISBN 10: 0071386246 ISBN 13: 9780071386241
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Descripción McGraw-Hill Education. Hardcover. Condición: New. 0071386246 Special order direct from the distributor. Nº de ref. del artículo: ING9780071386241

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