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Optical Interconnects (Synthesis Lectures on Solid State Materials and Devices) - Tapa blanda

 
9781598290660: Optical Interconnects (Synthesis Lectures on Solid State Materials and Devices)
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Páginas:104Géneros:12:TGB:Mechanicalengineering12:TJF:ElectronicsengineeringSinopsis:Thisbookdescribesfullyembeddedboardlevelopticalinterconnectindetailincludingthefabricationofthethin-filmVCSELarray,itscharacterization,thermalmanagement,thefabricationofopticalinterconnectionlayer,andtheintegrationofdevicesonaflexiblewaveguidefilm.AlltheopticalcomponentsareburiedwithinelectricalPCBlayersinafullyembeddedboardlevelopticalinterconnect.Therefore,wecansavefootprintsonthetoprealestateofthePCBandrelievepackagingdifficultyreducedbyseparatingfabricationprocesses.Torealizefullyembeddedboardlevelopticalinterconnects,manystumblingblocksneedtobeaddressedsuchasthin-filmtransmitteranddetector,thermalmanagement,processcompatibility,reliability,costeffectivefabricationprocess,andeasyintegration.Thematerialpresentedeventuallywillrelievesuchconcernsandmaketheintegrationofopticalinterconnectionhighlyfeasible.Thehybridintegrationoftheopticalinterconnectionlayerandelectricallayersisongoing._,

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This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical interconnects, many stumbling blocks need to be addressed such as thin-film transmitter and detector, thermal management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will relieve such concerns and make the integration of optical interconnection highly feasible. The hybrid integration of the optical interconnection layer and electrical layers is ongoing.

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  • EditorialMorgan and Claypool Publishers
  • Año de publicación2007
  • ISBN 10 1598290665
  • ISBN 13 9781598290660
  • EncuadernaciónTapa blanda
  • Número de páginas104

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Chen, Ray T.
ISBN 10: 1598290665 ISBN 13: 9781598290660
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Descripción Soft Cover. Condición: Good. Ex-library with the usual features. Library label on front cover. The interior is clean and tight. Binding is good. Cover shows light wear. Nº de ref. del artículo: 036023x

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