Publicado por Springer Berlin Heidelberg, 2011
ISBN 10: 3642231195 ISBN 13: 9783642231193
Idioma: Inglés
Librería: Buchpark, Trebbin, Alemania
EUR 41,68
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Añadir al carritoCondición: Sehr gut. Zustand: Sehr gut - Neubindung, Buchschnitt leicht verkürzt, Buchkanten leicht angestoßen, Ausgabe 2011 | Seiten: 212 | Sprache: Englisch | Produktart: Bücher.
Publicado por Springer Berlin Heidelberg, 2011
ISBN 10: 3642231195 ISBN 13: 9783642231193
Idioma: Inglés
Librería: AHA-BUCH GmbH, Einbeck, Alemania
EUR 53,49
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Añadir al carritoBuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.
Publicado por Springer Berlin Heidelberg, 2013
ISBN 10: 3642270727 ISBN 13: 9783642270727
Idioma: Inglés
Librería: AHA-BUCH GmbH, Einbeck, Alemania
EUR 53,49
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Añadir al carritoTaschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.
Librería: California Books, Miami, FL, Estados Unidos de America
EUR 61,78
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Publicado por Springer Berlin Heidelberg, Springer Berlin Heidelberg Aug 2011, 2011
ISBN 10: 3642231195 ISBN 13: 9783642231193
Idioma: Inglés
Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
EUR 53,49
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Añadir al carritoBuch. Condición: Neu. Neuware -This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 212 pp. Englisch.
Publicado por Springer-Verlag New York Inc, 2011
ISBN 10: 3642231195 ISBN 13: 9783642231193
Idioma: Inglés
Librería: Revaluation Books, Exeter, Reino Unido
EUR 80,61
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Añadir al carritoHardcover. Condición: Brand New. 2011 edition. 197 pages. 9.25x6.25x0.50 inches. In Stock.
Librería: Revaluation Books, Exeter, Reino Unido
EUR 86,76
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Añadir al carritoPaperback. Condición: Brand New. 2011 edition. 223 pages. 9.10x6.10x0.60 inches. In Stock.
Librería: Ria Christie Collections, Uxbridge, Reino Unido
EUR 94,31
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Publicado por Springer Berlin Heidelberg, Springer Berlin Heidelberg Nov 2013, 2013
ISBN 10: 3642270727 ISBN 13: 9783642270727
Idioma: Inglés
Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
EUR 83,46
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Añadir al carritoTaschenbuch. Condición: Neu. Neuware -This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 212 pp. Englisch.
Librería: Lucky's Textbooks, Dallas, TX, Estados Unidos de America
EUR 54,10
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Añadir al carritoCondición: New.
Librería: Mispah books, Redhill, SURRE, Reino Unido
EUR 101,90
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Añadir al carritoPaperback. Condición: Like New. Like New. book.
Publicado por Springer Berlin Heidelberg Nov 2013, 2013
ISBN 10: 3642270727 ISBN 13: 9783642270727
Idioma: Inglés
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
EUR 53,49
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Añadir al carritoTaschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems. 212 pp. Englisch.
Publicado por Springer Berlin Heidelberg Aug 2011, 2011
ISBN 10: 3642231195 ISBN 13: 9783642231193
Idioma: Inglés
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
EUR 53,49
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Añadir al carritoBuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems. 212 pp. Englisch.
Publicado por Springer Berlin Heidelberg, 2013
ISBN 10: 3642270727 ISBN 13: 9783642270727
Idioma: Inglés
Librería: moluna, Greven, Alemania
EUR 48,74
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Añadir al carritoCondición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. State-of-the-art researchFast-track conference proceedingsUnique visibilityThis book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Inte.
Publicado por Springer Berlin Heidelberg, 2011
ISBN 10: 3642231195 ISBN 13: 9783642231193
Idioma: Inglés
Librería: moluna, Greven, Alemania
EUR 48,74
Convertir monedaCantidad disponible: Más de 20 disponibles
Añadir al carritoGebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. State-of-the-art researchFast-track conference proceedingsUnique visibilityThis book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Inte.