system on chip methodologies design languages (17 resultados)

gebundene Ausgabe. Condición: Gut. 342 Seiten; Das hier angebotene Buch stammt aus einer teilaufgelösten wissenschaftlichen Bibliothek und trägt die entsprechenden Kennzeichnungen (Rückenschild, Instituts-Stempel.); Schnitt und Einband sind etwas staubschmutzig; der Buchzustand ist ansonsten ordentlich und dem Alter entsprechend gut. Text in ENGLISCHER Sprache! Sprache: Englisch Gewicht in Gramm: 780.

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Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - System-on-Chip Methodologies & Design Languages brings together a selection of the best papers from three international electronic design language conferences in 2000. The conferences are the Hardware Description Language Conference and Exhibition (HDLCon), held in the Silicon Valley area of USA; the Forum on Design Languages (FDL), held in Europe; and the Asia Pacific Chip Design Language (APChDL) Conference. The papers cover a range of topics, including design methods, specification and modeling languages, tool issues, formal verification, simulation and synthesis. The results presented in these papers will help researchers and practicing engineers keep abreast of developments in this rapidly evolving field.

Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - System-on-Chip Methodologies & Design Languages brings together a selection of the best papers from three international electronic design language conferences in 2000. The conferences are the Hardware Description Language Conference and Exhibition (HDLCon), held in the Silicon Valley area of USA; the Forum on Design Languages (FDL), held in Europe; and the Asia Pacific Chip Design Language (APChDL) Conference. The papers cover a range of topics, including design methods, specification and modeling languages, tool issues, formal verification, simulation and synthesis. The results presented in these papers will help researchers and practicing engineers keep abreast of developments in this rapidly evolving field.

Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -System-on-Chip Methodologies & Design Languages brings together a selection of the best papers from three international electronic design language conferences in 2000. The conferences are the Hardware Description Language Conference and Exhibition (HDLCon), held in the Silicon Valley area of USA; the Forum on Design Languages (FDL), held in Europe; and the Asia Pacific Chip Design Language (APChDL) Conference. The papers cover a range of topics, including design methods, specification and modeling languages, tool issues, formal verification, simulation and synthesis. The results presented in these papers will help researchers and practicing engineers keep abreast of developments in this rapidly evolving field. 356 pp. Englisch.

Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. System-on-Chip Methodologies & Design Languages brings together a selection of the best papers from three international electronic design language conferences in 2000. The conferences are the Hardware Description Language Conference and Exhibiti.

Gebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. System-on-Chip Methodologies & Design Languages brings together a selection of the best papers from three international electronic design language conferences in 2000. The conferences are the Hardware Description Language Conference and Exhibiti.

Buch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -System-on-Chip Methodologies & Design Languages brings together a selection of the best papers from three international electronic design language conferences in 2000. The conferences are the Hardware Description Language Conference and Exhibition (HDLCon), held in the Silicon Valley area of USA; the Forum on Design Languages (FDL), held in Europe; and the Asia Pacific Chip Design Language (APChDL) Conference. The papers cover a range of topics, including design methods, specification and modeling languages, tool issues, formal verification, simulation and synthesis. The results presented in these papers will help researchers and practicing engineers keep abreast of developments in this rapidly evolving field.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 356 pp. Englisch.

Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -System-on-Chip Methodologies & Design Languages brings together a selection of the best papers from three international electronic design language conferences in 2000. The conferences are the Hardware Description Language Conference and Exhibition (HDLCon), held in the Silicon Valley area of USA; the Forum on Design Languages (FDL), held in Europe; and the Asia Pacific Chip Design Language (APChDL) Conference. The papers cover a range of topics, including design methods, specification and modeling languages, tool issues, formal verification, simulation and synthesis. The results presented in these papers will help researchers and practicing engineers keep abreast of developments in this rapidly evolving field.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 356 pp. Englisch.

Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -System-on-Chip Methodologies & Design Languages brings together a selection of the best papers from three international electronic design language conferences in 2000. The conferences are the Hardware Description Language Conference and Exhibition (HDLCon), held in the Silicon Valley area of USA; the Forum on Design Languages (FDL), held in Europe; and the Asia Pacific Chip Design Language (APChDL) Conference. The papers cover a range of topics, including design methods, specification and modeling languages, tool issues, formal verification, simulation and synthesis. The results presented in these papers will help researchers and practicing engineers keep abreast of developments in this rapidly evolving field. 356 pp. Englisch.