Librería: ThriftBooks-Atlanta, AUSTELL, GA, Estados Unidos de America
EUR 16,20
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Añadir al carritoHardcover. Condición: Good. No Jacket. Missing dust jacket; Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less 1.55.
Librería: Toscana Books, AUSTIN, TX, Estados Unidos de America
EUR 44,22
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Añadir al carritoHardcover. Condición: new. Excellent Condition.Excels in customer satisfaction, prompt replies, and quality checks.
Librería: Hay-on-Wye Booksellers, Hay-on-Wye, HEREF, Reino Unido
EUR 24,48
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Añadir al carritoCondición: As New.
Librería: Romtrade Corp., STERLING HEIGHTS, MI, Estados Unidos de America
EUR 54,99
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Añadir al carritoCondición: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Librería: Basi6 International, Irving, TX, Estados Unidos de America
EUR 54,99
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Añadir al carritoCondición: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Publicado por William Andrew 1991-01-01, 1991
ISBN 10: 0815512813 ISBN 13: 9780815512813
Idioma: Inglés
Librería: Chiron Media, Wallingford, Reino Unido
EUR 47,16
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Añadir al carritoHardcover. Condición: New.
Librería: Revaluation Books, Exeter, Reino Unido
EUR 54,62
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Añadir al carritoHardcover. Condición: Brand New. 1st edition. 671 pages. 10.00x6.75x2.25 inches. In Stock.
Librería: Ria Christie Collections, Uxbridge, Reino Unido
EUR 67,98
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Añadir al carritoCondición: New. In.
Publicado por Elsevier Science & Technology, William Andrew, 1991
ISBN 10: 0815512813 ISBN 13: 9780815512813
Idioma: Inglés
Librería: AHA-BUCH GmbH, Einbeck, Alemania
EUR 65,55
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Añadir al carritoBuch. Condición: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings-- including optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely covered -- including an entire chapter on resist process defectivity and the potential yield limiting effect on device production. Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.