Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 228,70
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New.
Librería: California Books, Miami, FL, Estados Unidos de America
EUR 231,05
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New.
Librería: GreatBookPricesUK, Woodford Green, Reino Unido
EUR 215,56
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New.
Librería: Ria Christie Collections, Uxbridge, Reino Unido
EUR 218,42
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New. In.
EUR 186,70
Cantidad disponible: 5 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. Simulation of Semiconductor Processes and Devices 2004 | Gabriele Schrag (u. a.) | Taschenbuch | xii | Englisch | 2012 | Springer | EAN 9783709172124 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
EUR 213,99
Cantidad disponible: 1 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This volume contains the proceedings of the 10th edition of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2004), held in Munich, Germany, on September 2-4, 2004.The conference program included 7 invited plenary lectures and 82 contributed papers for oral or poster presentation, which were carefully selected out of a total of 151 abstracts submitted from 14 countries around the world.Like the previous meetings, SISPAD 2004 provided a world-wide forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance. The variety of topics covered by the conference contributions reflects the physical effects and technological problems encountered in consequence of the progressively shrinking device dimensions and the ever-growing complexity in device technology.
Librería: Revaluation Books, Exeter, Reino Unido
EUR 301,55
Cantidad disponible: 2 disponibles
Añadir al carritoPaperback. Condición: Brand New. reprint edition. 392 pages. 9.25x6.10x0.90 inches. In Stock.
Librería: GreatBookPricesUK, Woodford Green, Reino Unido
EUR 301,01
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: As New. Unread book in perfect condition.
Librería: Mispah books, Redhill, SURRE, Reino Unido
EUR 291,54
Cantidad disponible: 1 disponibles
Añadir al carritoPaperback. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 327,56
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: As New. Unread book in perfect condition.
Librería: Brook Bookstore On Demand, Napoli, NA, Italia
EUR 166,29
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: new. Questo è un articolo print on demand.
Librería: moluna, Greven, Alemania
EUR 180,07
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This volume contains the proceedings of the 10th edition of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2004), held in Munich, Germany, on September 2-4, 2004.The conference program included 7 invited plenary le.
Idioma: Inglés
Publicado por Springer Vienna Nov 2012, 2012
ISBN 10: 3709172128 ISBN 13: 9783709172124
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
EUR 213,99
Cantidad disponible: 2 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This volume contains the proceedings of the 10th edition of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2004), held in Munich, Germany, on September 2-4, 2004.The conference program included 7 invited plenary lectures and 82 contributed papers for oral or poster presentation, which were carefully selected out of a total of 151 abstracts submitted from 14 countries around the world.Like the previous meetings, SISPAD 2004 provided a world-wide forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance. The variety of topics covered by the conference contributions reflects the physical effects and technological problems encountered in consequence of the progressively shrinking device dimensions and the ever-growing complexity in device technology. 396 pp. Englisch.
Idioma: Inglés
Publicado por Springer Vienna, Springer Vienna Nov 2012, 2012
ISBN 10: 3709172128 ISBN 13: 9783709172124
Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
EUR 213,99
Cantidad disponible: 1 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This volume contains the proceedings of the 10th edition of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2004), held in Munich, Germany, on September 2-4, 2004.The conference program included 7 invited plenary lectures and 82 contributed papers for oral or poster presentation, which were carefully selected out of a total of 151 abstracts submitted from 14 countries around the world.Like the previous meetings, SISPAD 2004 provided a world-wide forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance. The variety of topics covered by the conference contributions reflects the physical effects and technological problems encountered in consequence of the progressively shrinking device dimensions and the ever-growing complexity in device technology.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 396 pp. Englisch.