9780442012366 - Multichip Module Technologies and Alternatives: The Basics de Doane, Daryl Ann; Franzon, Paul (17 resultados)

Condición: good. A copy that has been read, remains in good condition. All pages are intact, and the cover is intact. The spine and cover show signs of wear. Pages can include notes and highlighting and show signs of wear, and the copy can include "From the library of" labels or previous owner inscriptions. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item for full refund. Ships via media mail.

Paperback. Condición: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

Hardcover. Condición: Very Good. Pages clean & bright; binding tight; very minor wear to covers. 875 pages. Illustrated. "Emphasizing MCM fundamentals and reporting real MCM experiences, this book is intended for those who need a broad exposure to the concepts underlying the design, fabrication, packaging, assembly and manufacture of multichip modules." Size: 6" x 9".

Paperback. Condición: New.

Condición: Like New. Used - Like New. Book is new and unread but may have minor shelf wear. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.

paperback. Condición: New. In shrink wrap. Looks like an interesting title!

Condición: New.

Condición: New.

Condición: New. In.

Hardcover. Condición: new. Hardcover. This study provides a framework for understanding the multichip module (MCM) technologies available for package selection. It considers system needs, costs and such technical considerations as electrical and thermal design, materials and processes, chip and substrate attach options, and test, assembly and repair requirements. In addition to offering techniques on MCM construction, the book reveals the decision-making process involved in the design, fabrication, manufacturing and marketing of an MCM-based product. Case studies, drawn from the practical experiences of leading MCM manufacturers in the computer, military and aerospace industries, illustrate technical and decision-making strategies. Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.

Condición: New. Provides a framework for understanding the multichip module (MCM) technologies available for package selection. This book is useful for engineers concerned with the design and systems integration of products and technical managers who decide how to apply to technologies. Num Pages: 875 pages, biography. BIC Classification: UM. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 229 x 152 x 55. Weight in Grams: 1500. . 1992. Hardback. . . . .

Gebunden. Condición: New. Far from being the passive containers for semiconductor devices of the past, the packages in today s high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance me.

Hardcover. Condición: Like New. Like New. book.

Condición: As New. Unread book in perfect condition.

Condición: New. Provides a framework for understanding the multichip module (MCM) technologies available for package selection. This book is useful for engineers concerned with the design and systems integration of products and technical managers who decide how to apply to technologies. Num Pages: 875 pages, biography. BIC Classification: UM. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 229 x 152 x 55. Weight in Grams: 1500. . 1992. Hardback. . . . . Books ship from the US and Ireland.

Taschenbuch. Condición: Neu. Neuware - Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.

Hardcover. Condición: new. Hardcover. This study provides a framework for understanding the multichip module (MCM) technologies available for package selection. It considers system needs, costs and such technical considerations as electrical and thermal design, materials and processes, chip and substrate attach options, and test, assembly and repair requirements. In addition to offering techniques on MCM construction, the book reveals the decision-making process involved in the design, fabrication, manufacturing and marketing of an MCM-based product. Case studies, drawn from the practical experiences of leading MCM manufacturers in the computer, military and aerospace industries, illustrate technical and decision-making strategies. Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.