A s m international materials park (8 resultados)

Hard Cover. Condición: Good. No Jacket. First Thus. From an academic library with the usual stamps etc. This item is heavy and will attract postal surcharges.

Hard Cover. Condición: Good. No Jacket. First Thus. From an academic library with the usual stamps etc. This item is heavy and will attract postal surcharges.

Hard Cover. Condición: Good. No Jacket. Reprint. From an academic library with the usual stamps etc. This item is heavy and will attract postal surcharges.

Paperback. Condición: new. Paperback. The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; scanning probe analysis; hardware attacks, security, and reverse engineering; microscopy and material characterization; nanoprobing and electrical characterization; and more.In the 21st century, the electronic market will be driven by consumers with demands of immediate entertainment, fast access to information, and communications anywhere in a personalized fashion and at affordable prices. The new challenge is not how many transistors can be built on a single chip, as in System-on-Chip (SoC), but rather how to integrate diverse circuits together predictably, harmoniously, and cost effectively. Instead of getting twice the transistors for the same cost as Moore's Law predicted in the past 50 years, the goal of SiP is to obtain the same number of transistors for half the cost within less than half the time to market. The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; and scanning probe analysis. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…

Hard cover. Condición: Very good. 850 p. ASM Handbook. Audience: Professional and scholarly.

Paperback. Condición: new. Paperback. The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; scanning probe analysis; hardware attacks, security, and reverse engineering; microscopy and material characterization; nanoprobing and electrical characterization; and more.In the 21st century, the electronic market will be driven by consumers with demands of immediate entertainment, fast access to information, and communications anywhere in a personalized fashion and at affordable prices. The new challenge is not how many transistors can be built on a single chip, as in System-on-Chip (SoC), but rather how to integrate diverse circuits together predictably, harmoniously, and cost effectively. Instead of getting twice the transistors for the same cost as Moore's Law predicted in the past 50 years, the goal of SiP is to obtain the same number of transistors for half the cost within less than half the time to market. The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; and scanning probe analysis. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.…

Hardcover. Condición: new. Hardcover. ASM Handbook, Volume 17 helps readers select, use, and interpret methods used to nondestructively test and analyze engineered products and assemblies. Digital technology is transforming the implementation of NDE and is covered extensively. New case studies and examples illustrate specific NDE techniques and give new insights which are needed to provide the data needed to solve many real-world NDE problems, to understand and measure early degradation, and to give the required data for remaining safe life or prognostic prediction. Helps readers select, use, and interpret methods used to non-destructively test and analyse engineered products and assemblies. New case studies and examples illustrate specific NDE techniques and provide the data needed to solve many real-world NDE problems, to understand and measure early degradation, and to give the required data for remaining safe life or prognostic prediction. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…

Hardcover. Condición: new. Hardcover. ASM Handbook, Volume 17 helps readers select, use, and interpret methods used to nondestructively test and analyze engineered products and assemblies. Digital technology is transforming the implementation of NDE and is covered extensively. New case studies and examples illustrate specific NDE techniques and give new insights which are needed to provide the data needed to solve many real-world NDE problems, to understand and measure early degradation, and to give the required data for remaining safe life or prognostic prediction. Helps readers select, use, and interpret methods used to non-destructively test and analyse engineered products and assemblies. New case studies and examples illustrate specific NDE techniques and provide the data needed to solve many real-world NDE problems, to understand and measure early degradation, and to give the required data for remaining safe life or prognostic prediction. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.…