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Characterization of Laser Doped Silicon and Overcoming Adhesion Challenges of Solar Cells with Nickel-Copper Plated Contacts. (Paperback)

Christian Geisler

ISBN 10: 383960916X / ISBN 13: 9783839609163
Editorial: Fraunhofer Verlag, N/A, 2015
Nuevos Condición: New Encuadernación de tapa blanda
Librería: The Book Depository EURO (London, Reino Unido)

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Language: English. Brand new Book. The combination of localized laser patterning and metal plating allows to replace conventional silver screen printing with nickel-copper plating to form inexpensive front contacts for crystalline silicon solar cells. In this work, a focus is put on effects that could cause inhomogeneous metal deposition and low metal contact adhesion. A descriptive model of the silicon nitride ablation mechanism is derived from SEM imaging and a precise recombination analysis using QSSPC measurements. Surface sensitive XPS measurements are conducted to prove the existence of a parasitic surface layer, identified as SiOxNy. The dense SiOxNy layer is an effective diffusion barrier, hindering the formation of a nickel silicide interlayer. After removal of the SiOxNy layer, cells show severe degradation caused by metal-induced shunting. These shunts are imaged using reverse biased electroluminescence imaging. A shunting mechanism is proposed and experimentally verified. New laser process sequences are devised and proven to produce cells with adhering Ni-Cu contacts. Conclusively the developed processes are assessed based on their industrial feasibility as well as on their efficiency potential. N° de ref. de la librería LIB9783839609163

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Detalles bibliográficos

Título: Characterization of Laser Doped Silicon and ...

Editorial: Fraunhofer Verlag, N/A

Año de publicación: 2015

Encuadernación: Paperback

Condición del libro: New

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