Artículos relacionados a Materials for Advanced Packaging

Materials for Advanced Packaging - Tapa blanda

 
9783319832098: Materials for Advanced Packaging
Tapa blanda
ISBN 10: 3319832093 ISBN 13: 9783319832098
Editorial: Springer Nature B.V., 2018

Sinopsis

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

"Sinopsis" puede pertenecer a otra edición de este libro.

Acerca del autor

Dr. Daniel Lu is the Vice President of Technology, Henkel Corporation in Asia Pacific. Prior to joining Henkel, he worked for the R&D department of Intel Corp (Arizona, USA) as a Sr. Scientist for 7 years. He received his MS and PhD degrees on Polymer Science and Engineering from Georgia Institute of Technology in 1996 and 2000, respectively. Dr. Lu received many awards including the IEEE/CPMT Outstanding Young Engineer Award in 2004, the IEEE ECTC best poster paper in 2007, Intel’s most patent filing in 2003-2007, etc. Dr. Lu has published more than 50 journal papers, wrote chapters for six books, and holds more than 80 US and international patents. He is the editor of the book “Materials for Advanced Packaging (2008)” and co-author of the book “Electronically Conductive Adhesives with Nanotechnologies (2009)”. He has been serving key roles in organizing international electronic packaging conferences and teaching professional development courses in these conferences. Dr. Lu is a senior member of IEEE, and an associate editor of IEEE Transactions on Advanced Packaging and Journal of Nanomaterials, and an editorial board member of Nanoscience & Nanotechnology-Asia. Dr. Lu also serves as an adjunct professor in Huazhong University of Science and Technology, and SIAT (Shenzhen Institute of Advanced Technologies), Chinese Academy of Science. Dr. Lu has more 15 years of experience in electronic packaging and is an expert in electronic packaging materials and processing.

Professor C.P. Wong is with the School of Materials Sciences and Engineering at Georgia Tech (GT) and also is the Dean of Engineering, The Chinese University of Hong Kong. Prior to joining GT, he was with AT&T Bell Laboratories for many years and was an AT&T Bell Labs Fellow. His research interests focus on the areas of material and process for electronic, photonic, MEMS, sensors, and energy harvesting and storage. He has published over 1,000 technical papers, 12 books and holds over 65 US Patents. He is a member of the US National Academy of Engineering and a Foreign Academician of the Chinese Academy of Engineering.

De la contraportada

This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D package architectures, novel bonding and joining techniques, wire bonding, wafer thinning techniques, organic substrates, and novel approaches to make electrical interconnects between integrated circuit and substrates. Various chapters also address advances in several key packaging materials, including:

  •        Lead-free solders
  •         Flip chip underfills
  •         Epoxy molding compounds
  •         Conductive adhesives
  •         Die attach adhesives/films
  •         Thermal interface materials (TIMS)
  •         Materials for fabricating embedded passives including capacitors, inductors, and resistors
  •         Materials and processing aspects on wafer-level chip scale package (CSP) and MicroElectroMechanical system (MEMS)

Contributors also review new and emerging technologies such as Light Emitting Diode (LED) packaging, as well as packaging for medical devices, flexible and printed electronics, interconnection technologies for solar cells, and nano-metal assisted chemical etching. This book is ideal for professionals in semiconductor fabrication, packaging of electronic and optoelectronic devices and solar cells and medical device packaging areas as well as graduate students studying materials science and engineering or electronic packaging materials and processing.

"Sobre este título" puede pertenecer a otra edición de este libro.

Editorial
Springer Nature B.V.
Año de publicación
2018
Idioma
Inglés
ISBN 10 
3319832093
ISBN 13 
9783319832098
Encuadernación
Tapa blanda
Número de páginas
969
Editor
Lu Daniel, Wong C.P.
Contacto del fabricante
no disponible
Persona responsable
no disponible