Reflow Soldering Processes

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9780750672184: Reflow Soldering Processes

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel.

Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable.
Provides engineers the cutting-edge technology in a rapidly changing field

Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process

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From the Publisher:

Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable.

About the Author:

Dr. Ning-Cheng Lee is the Vice President of Technology for Indium Corporation of America

"Sobre este título" puede pertenecer a otra edición de este libro.

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Lee PhD, Ning-Cheng
Editorial: Newnes (2002)
ISBN 10: 0750672188 ISBN 13: 9780750672184
Nuevos Tapa dura Cantidad: 2
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Murray Media
(North Miami Beach, FL, Estados Unidos de America)
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Descripción Newnes, 2002. Hardcover. Estado de conservación: New. Never used!. Nº de ref. de la librería P110750672188

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Lee PhD, Ning-Cheng
Editorial: Newnes (2002)
ISBN 10: 0750672188 ISBN 13: 9780750672184
Nuevos Tapa dura Cantidad: 2
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Save With Sam
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Descripción Newnes, 2002. Hardcover. Estado de conservación: New. Brand New!. Nº de ref. de la librería VIB0750672188

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Lee PhD, Ning-Cheng
Editorial: Newnes (2002)
ISBN 10: 0750672188 ISBN 13: 9780750672184
Nuevos Tapa dura Cantidad: 1
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Buyback Express
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Descripción Newnes, 2002. Hardcover. Estado de conservación: New. BRAND NEW BOOK!! SHIPS WITHIN 24 HOURS! Tracking Provided. DHL processing & USPS delivery for an average of 3-5 Day Standard & 2-3 Day Expedited! FREE INSURANCE! Fast & Personal Support! Careful Packaging. No Hassle, Full Refund Return Policy!. Nº de ref. de la librería mon0000591294

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Ning-Cheng Lee PhD
Editorial: Newnes (2002)
ISBN 10: 0750672188 ISBN 13: 9780750672184
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Descripción Newnes, 2002. Hardcover. Estado de conservación: New. 1. Nº de ref. de la librería DADAX0750672188

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Ning-Cheng Lee PhD
Editorial: Newnes (2002)
ISBN 10: 0750672188 ISBN 13: 9780750672184
Nuevos Tapa dura Primera edición Cantidad: 1
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Irish Booksellers
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Descripción Newnes, 2002. Hardcover. Estado de conservación: New. book. Nº de ref. de la librería M0750672188

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