Soldering in Electronics Assembly

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9780750605892: Soldering in Electronics Assembly

"Soldering in Electronics Assembly" starts at the bottom and works its way right to the top of this vast technical, yet practical subject. It covers all relevant aspects of the area, looking theoretically at every facet likely to be needed in a detailed study, yet it does so in a most practical manner. The book looks at soldering processes in the light of electronic assembly type, solder, flux and cleaning requirements. Every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wavesoldering and zoned forced convection infra-red machines are covered. Separate chapters consider safety and solder process quality assessment. Other important topics covered are: and a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability; a detailed analysis of soldering process defects and causes. The book is intended for use during industrial construction of electronics assemblies at a professional level. Managers, engineers and technicians involved in the soldering process can use the book as a reference to see the variety of methods available together with an up-to-date discussion of technical concerns.

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From the Publisher:

Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology.

Mike Judd is MD of Mike Judd Marketing and former MD of Electrovert UK, Director of Marketing Europe for Electrovert, part of the Cookson Group, and Director of OEM at Speedline.

Keith Brindley is a technical author with a wealth of experience of all aspects of electronics technology.

From the Back Cover:

Soldering in Electronics Assembly is a unique survey of the state of the art in industrial contruction of electronics assemblies. the main techniques of industrial soldering are explored in terms of principles, best-practice, quality issues, fault-finding and troubleshooting. It is essential reading for managers, production engineersand technical professionals, and an invaluable guide to the subject for students of electrical engineering and professional trainees.

The second edition has been fully updated to cover the latest technical developments. A major addition is a photographic guide to defects, contributed by Bob Willis, a renowned trainer in this field.

Soldering in Electronics Assembly
* looks at soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements
* covers every available process, from hand soldering through to the latest developments, such as inert atmosphere wave soldering and zoned force convection reflow machines
* provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability; and soldering process defects and causes
* includes new sections on Ball Grid Array (BGA) technology and the hot opic of lead-free soldering

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