Today, the successful design and manufacture of electronic devices requires expertise in both materials science and manufacturing processes. This reference provides electronics engineers and materials scientists with the information they need on the materials and processes currently used to fabricate, interconnect and package electronic components and systems. Featuring more than 70 percent new or revised material, the second edition of this reference contains information on plastics, elastomers, and laminates; printed wiring boards; ceramics and glasses semiconductors; ferrous and nonferrous metals; wire and cable; metal joining of electronic circuits; thick and thin films; electrodeposition materials and processes; lithography and photofabrication; and materials and processes for advanced packaging.
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Charles A. Harper is president of Technology Seminars, Inc., an organization devoted to presenting seminars on electronic packaging and related subjects to the electronics industry. He is a graduate of The John Hopkins University School of Engineering , Baltimore, MD., and a past member of the engineering faculty of The Johns Hopkins University. He is active in numerous professional societies, including the International Microelectronics and Packaging Society (of which he is a past president), the National Electronic Packaging Conference (NEPCON), and the Institute of Electrical and Electronics Engineers. He is series editor of McGraw-Hill's Electronic Packaging and Interconnection Technology Series and a member of the Editorial Advisory Board of Electronic Packaging and Production magazine.
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Librería: Vashon Island Books, Vashon, WA, Estados Unidos de America
Hardcover. Condición: Very Good+. Estado de la sobrecubierta: No Dust Jacket. Second Edition. Signed and Inscribed By Author Ronald Sampson on free front endpaper: "To George Rudd, whose friendship has enriched my life. Ron Sampson - 4-7-94". Size: 8vo - over 7¾" - 9¾". Signed and Inscribed By Author. Book. Nº de ref. del artículo: 0841662
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Librería: ThriftBooks-Atlanta, AUSTELL, GA, Estados Unidos de America
Hardcover. Condición: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less. Nº de ref. del artículo: G0070542996I3N00
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Librería: ThriftBooks-Dallas, Dallas, TX, Estados Unidos de America
Hardcover. Condición: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less. Nº de ref. del artículo: G0070542996I3N00
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Librería: Books From California, Simi Valley, CA, Estados Unidos de America
Hardcover. Condición: Very Good. Nº de ref. del artículo: mon0003475589
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Librería: Better World Books Ltd, Dunfermline, Reino Unido
Condición: Good. 2nd Edition. Ships from the UK. Former library book; may include library markings. Used book that is in clean, average condition without any missing pages. Nº de ref. del artículo: GRP29997827
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Librería: BookDepart, Shepherdstown, WV, Estados Unidos de America
Hardcover. Condición: New. Hardcover, 2nd edition remainder; may have light scuffing to exterior as a result of warehouse storage. Nº de ref. del artículo: 71000
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Librería: Red's Corner LLC, Tucker, GA, Estados Unidos de America
hardcover. Condición: New. All orders ship by next business day! This is a new book. We are a small company and very thankful for your business! Nº de ref. del artículo: 4CNZE900000O
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Librería: Anybook.com, Lincoln, Reino Unido
Condición: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1150grams, ISBN:9780070542990. Nº de ref. del artículo: 5826697
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Librería: The Book Spot, Sioux Falls, MN, Estados Unidos de America
Hardcover. Condición: New. Nº de ref. del artículo: Abebooks18643
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