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Publicado por Wiley-Scrivener, 2019
ISBN 10: 1119083591ISBN 13: 9781119083597
Librería: Books From California, Simi Valley, CA, Estados Unidos de America
Libro
Hardcover. Condición: Very Good.
Publicado por Wiley-Scrivener, 2019
ISBN 10: 1119083591ISBN 13: 9781119083597
Librería: Basi6 International, Irving, TX, Estados Unidos de America
Libro
Condición: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Publicado por William Andrew, 2009
ISBN 10: 0815515766ISBN 13: 9780815515760
Librería: Brook Bookstore On Demand, Napoli, NA, Italia
Libro Impresión bajo demanda
Condición: new. Questo è un articolo print on demand.
Publicado por William Andrew 2009-07-22, 2009
ISBN 10: 0815515766ISBN 13: 9780815515760
Librería: Chiron Media, Wallingford, Reino Unido
Libro
Hardcover. Condición: New.
Publicado por John Wiley & Sons, 2019
ISBN 10: 1119083591ISBN 13: 9781119083597
Librería: Books Puddle, New York, NY, Estados Unidos de America
Libro
Condición: New. 350.
Publicado por Wiley-Scrivener, 2019
ISBN 10: 1119083591ISBN 13: 9781119083597
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
Libro
Condición: New.
Publicado por WILLIAM ANDREW INC Jun 2009, 2009
ISBN 10: 0815515766ISBN 13: 9780815515760
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
Libro Impresión bajo demanda
Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations. Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-shelf (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability. With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packaging (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechanical systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs). This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology. 504 pp. Englisch.
Publicado por William Andrew Pub, 2009
ISBN 10: 0815515766ISBN 13: 9780815515760
Librería: Revaluation Books, Exeter, Reino Unido
Libro
Hardcover. Condición: Brand New. 1st edition. 504 pages. 9.25x6.25x1.25 inches. In Stock.
Publicado por John Wiley & Sons, 2019
ISBN 10: 1119083591ISBN 13: 9781119083597
Librería: Majestic Books, Hounslow, Reino Unido
Libro
Condición: New. 350.
Publicado por Lala Maurizio, 2018
ISBN 10: 0128119780ISBN 13: 9780128119785
Librería: Brook Bookstore On Demand, Napoli, NA, Italia
Libro Impresión bajo demanda
Condición: new. Questo è un articolo print on demand.
Publicado por Wiley-Scrivener, 2019
ISBN 10: 1119083591ISBN 13: 9781119083597
Librería: GreatBookPricesUK, Castle Donington, DERBY, Reino Unido
Libro
Condición: New.
Publicado por Wiley-Scrivener, 2019
ISBN 10: 1119083591ISBN 13: 9781119083597
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
Libro
Condición: As New. Unread book in perfect condition.
Publicado por Elsevier Science & Technology|William Andrew, 2009
ISBN 10: 0815515766ISBN 13: 9780815515760
Librería: moluna, Greven, Alemania
Libro Impresión bajo demanda
Gebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Offers a comprehensive discussion of encapsulants in electronic applications. This work emphasizes on the encapsulation of microelectronic devices. It discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally frien.
Publicado por William Andrew, 2018
ISBN 10: 0128119780ISBN 13: 9780128119785
Librería: GF Books, Inc., Hawthorne, CA, Estados Unidos de America
Libro
Condición: Fine. Book is in Used-LikeNew condition. Pages and cover are clean and intact. Used items may not include supplementary materials such as CDs or access codes. May show signs of minor shelf wear.
Publicado por Wiley-Scrivener, 2019
ISBN 10: 1119083591ISBN 13: 9781119083597
Librería: Lucky's Textbooks, Dallas, TX, Estados Unidos de America
Libro
Condición: New.
Publicado por William Andrew, 2018
ISBN 10: 0128119780ISBN 13: 9780128119785
Librería: GF Books, Inc., Hawthorne, CA, Estados Unidos de America
Libro
Condición: New. Book is in NEW condition.
Publicado por William Andrew, 2018
ISBN 10: 0128119780ISBN 13: 9780128119785
Librería: Book Deals, Tucson, AZ, Estados Unidos de America
Libro
Condición: New. New! This book is in the same immaculate condition as when it was published.
Publicado por Wiley-Scrivener, 2019
ISBN 10: 1119083591ISBN 13: 9781119083597
Librería: booksXpress, Bayonne, NJ, Estados Unidos de America
Libro Impresión bajo demanda
Hardcover. Condición: new. This item is printed on demand.
Publicado por Elsevier Science, 2009
ISBN 10: 0815515766ISBN 13: 9780815515760
Librería: AHA-BUCH GmbH, Einbeck, Alemania
Libro Impresión bajo demanda
Buch. Condición: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations. Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-shelf (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability. With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packaging (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechanical systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs). This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology.
Publicado por William Andrew, 2018
ISBN 10: 0128119780ISBN 13: 9780128119785
Librería: Books Unplugged, Amherst, NY, Estados Unidos de America
Libro
Condición: Good. Buy with confidence! Book is in good condition with minor wear to the pages, binding, and minor marks within.
Publicado por William Andrew, 2018
ISBN 10: 0128119780ISBN 13: 9780128119785
Librería: Book Deals, Tucson, AZ, Estados Unidos de America
Libro
Condición: Fine. Like New condition. Great condition, but not exactly fully crisp. The book may have been opened and read, but there are no defects to the book, jacket or pages.
Publicado por William Andrew, 2018
ISBN 10: 0128119780ISBN 13: 9780128119785
Librería: Book Deals, Tucson, AZ, Estados Unidos de America
Libro
Condición: Very Good. Very Good condition. Shows only minor signs of wear, and very minimal markings inside (if any).
Publicado por William Andrew, 2018
ISBN 10: 0128119780ISBN 13: 9780128119785
Librería: GF Books, Inc., Hawthorne, CA, Estados Unidos de America
Libro
Condición: Very Good. Book is in Used-VeryGood condition. Pages and cover are clean and intact. Used items may not include supplementary materials such as CDs or access codes. May show signs of minor shelf wear and contain very limited notes and highlighting.
Publicado por William Andrew, 2018
ISBN 10: 0128119780ISBN 13: 9780128119785
Librería: Books Unplugged, Amherst, NY, Estados Unidos de America
Libro
Condición: Fair. Buy with confidence! Book is in acceptable condition with wear to the pages, binding, and some marks within.
Publicado por Elsevier Science Ltd, 2018
ISBN 10: 0128119780ISBN 13: 9780128119785
Librería: Revaluation Books, Exeter, Reino Unido
Libro
Paperback. Condición: Brand New. 2nd reprint edition. 498 pages. 8.75x6.00x1.25 inches. In Stock.
Publicado por Wiley-Scrivener, 2019
ISBN 10: 1119083591ISBN 13: 9781119083597
Librería: GreatBookPricesUK, Castle Donington, DERBY, Reino Unido
Libro
Condición: As New. Unread book in perfect condition.
Publicado por William Andrew, 2018
ISBN 10: 0128119780ISBN 13: 9780128119785
Librería: Ria Christie Collections, Uxbridge, Reino Unido
Libro Impresión bajo demanda
Condición: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book.
Publicado por Wiley-Scrivener, 2019
ISBN 10: 1119083591ISBN 13: 9781119083597
Librería: Mispah books, Redhill, SURRE, Reino Unido
Libro
Hardcover. Condición: New. New. book.
Publicado por William Andrew, 2018
ISBN 10: 0128119780ISBN 13: 9780128119785
Librería: moluna, Greven, Alemania
Libro
Condición: New. Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors .
Publicado por William Andrew, 2013
ISBN 10: 0323165494ISBN 13: 9780323165495
Librería: Revaluation Books, Exeter, Reino Unido
Libro
Paperback. Condición: Brand New. 498 pages. 9.00x6.00x1.13 inches. In Stock.